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Low-Power, Highly Reliable Dynamic Thermal Management by Exploiting Approximate Computing
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With the continuous downscaling of semiconductor processes, the growing power density and thermal issues in multicore processors become more and more challenging, thus reliable dynamic thermal management (DTM) is required to prevent severe challenges in system performance. The accuracy of the thermal profile, delivered to the DTM manager, plays a critical role in the efficiency and reliability of DTM, different sources of noise and variations in deep submicron (DSM) technologies severely affecting the thermal data that can lead to significant degradation of DTM performance. In this article, we propose a novel fault-tolerance scheme exploiting approximate computing to mitigate the DSM effects on DTM efficiency. Approximate computing in hardware design can lead to significant gains in energy efficiency, area, and performance. To exploit this opportunity, there is a need for design abstractions that can systematically incorporate approximation in hardware design which is the main contribution of our work. Our proposed scheme achieves 11.20% lower power consumption, 6.59% smaller area, and 12% reduction in the number of wires, while increasing DTM efficiency by 5.24%.

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Publication Date
Mon Mar 07 2022
Journal Name
Journal Of Inorganic And Organometallic Polymers And Materials
Mechanical Characteristics and Thermal Stability of Hybrid Epoxy and Acrylic Polymer Coating/Nanoclay of Various Thicknesses
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Publication Date
Tue Nov 01 2022
Journal Name
Computers And Electronics In Agriculture
A novel heat-pulse probe for measuring soil thermal conductivity: Field test under different tillage practices
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Publication Date
Mon Mar 08 2021
Journal Name
Baghdad Science Journal
Theoretical study to find the thermal stress and strain generated in the Wood silica using lasers
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In this research study theory to find the stress and emotion gases in the glass as a result of exposure to pulses of the laser beam has been the study using vehicles three major on-system axes cylindrical (r, 0, z), where I took three models of glass silica glass soda glass fused and shedtwo types of lasers where the study showed that the thermal stresses and emotions ...

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Publication Date
Thu Jun 07 2018
Journal Name
Applied Physics A
Effect of incorporation of conductive fillers on mechanical properties and thermal conductivity of epoxy resin composite
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Publication Date
Thu Feb 01 2018
Journal Name
Applied Energy
Solidification enhancement of PCM in a triplex-tube thermal energy storage system with nanoparticles and fins
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Publication Date
Fri Oct 01 2010
Journal Name
Iraqi Journal Of Physics
The effect of TiO2 addition on the thermal conductivity of Polymethylmetha acrylate, Polycarbonate and Polystyrene Polymers
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Thermal conductivity measurement was done for specimens of Polystyrene/ titanium dioxide, Polycarbonate/ titanium dioxide and Polymethylmetha acrylate/ titanium dioxide composites for weight ratio of 1.9/ 0.1 and 1.8/ 0.2 wt% for different thickness of the samples. The experimental results show that the thermal conductivity is increased with the increasing of thickness of layers and with the weight ratio of TiO2

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Publication Date
Mon Sep 10 2018
Journal Name
Iraqi Journal Of Physics
Thermal conductivity and diffusion coefficient of polymer blend 80%EP/20%UPE reinforced with sand particles
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New polymer blend with enhanced properties was prepared from (80 %) epoxy resin (Ep), (20%) unsaturated polyester resin (UPE) as a matrix material. The as-obtained polymer blend was further reinforced by adding Sand particles of particle size (53 μm) with various weight fraction (5, 10, 15, 20 %). Thermal conductivity and sorption measurements are performed in order to determine diffusion coefficient in different chemical solutions (NaOH, HCl) with concentration (0.3N) after immersion for specific period of time (30 days). The obtained results demonstrate that the addition of sand powder to (80%EP/20%UPE) blend leads to an increase of thermal conductivity, with an optimum/minimum diffusion coefficient in (HCl)/(NaOH), respectively.

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Publication Date
Thu Jan 01 2015
Journal Name
Finite Difference Methods,theory And Applications
Determination of the Time-Dependent Thermal Conductivity in the Heat Equation with Spacewise Dependent Heat Capacity
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Publication Date
Sun Sep 01 2024
Journal Name
Inorganic Chemistry Communications
Investigation of optical, mechanical, thermal, wettability, and antibacterial activity of polyvinyl alcohol mixed with clay nanoparticles
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Publication Date
Mon Dec 30 2002
Journal Name
Iraqi Journal Of Chemical And Petroleum Engineering
Thermal Conductivity Characteristics of Polymer composites Based on Polyethylene Wastes Filled with Post-Industry Wood Wastes
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